Events

RPS to attend the Engineering Expo, Subcon Show – 4-6 June, NEC Birmingham

By May 29, 2019 No Comments

RPS will be exhibiting at the Engineering Expo show, part of Subcon, held at NEC Birmingham 4-6 June.

Our expert team will be available at stand E76 to chat about the range of hardware, materials and support we offer at RPS, including HP’s new Multi-Jet Fusion 5200 range.  With a focus on volume production, repeatability and accuracy, the HP Multi-Jet Fusion 5200 is perfect for companies wanting to expand and scale into mid-volume production environments.

As well as 3D printing application advice, on display at the Engineering Expo we will have a range of 3D printed parts from HP’s Multi-Jet Fusion technology, printed parts from our NEO800 stereolithography system using DSM resin and SLS parts printed using ALM powders.

We look forward to seeing you on stand E76 at the Engineering Expo to find out more about how RPS can help you with your 3D printing application and any industrial 3D printing service or support needs.

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